Copper Board Material
Copper cladded FR4 board material. Epoxy substrate with glass fiber enforcment. Compliant with electroplating.
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Multi Layer Material
Multi-Layer material and accessories.
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Prototype SMT Stencils
Polymide foil to be cut with ProtoMat plotter to create prototype SMT stencils. Compatible with ZelFlex stencil frame.
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Solder Mask and Silk Screen
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Solder Paste
Lead-Free Solder Paste
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Underlay Material
Underlay material is used to protect the LPKF machine’s table top or vacuum table during the drilling and routing phases. The LPKF underlay material is very flat & has a smooth surface with a white, very thin, hard coating on both sides to meet the highest demands for drilling quality.
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