MultiPress S

MultiPress S

Bench-Top Hydraulic Press for Multilayer PCBs

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A bench-top multilayer press, ideal for creating multilayer circuit boards in a laboratory of prototyping environment.

The LPKF MultiPress S is a bench-top multilayer press, ideal for creating multilayer circuit boards in a laboratory or prototyping environment. The MultiPress S is useful when speed, security, or convenience are key factors in the creation of custom or prototype printed circuit boards and is an indispensable tool in any rapid PCB prototyping situation. With a shorter pressing time of approximately ninety minutes, the system offers faster turnaround times than ever before: develop production-quality multilayer prototype boards.

Bringing Multilayer Prototyping In-House

Rapid PCB prototyping achieves a new level of utility with the LPKF MultiPress S. When combined with a ProtoMat PCB milling system with fiducial camera and a through-hole conductivity solution (such as the ProConduct® or MiniContac system), the MultiPress S provides the final key to producing complex multilayered printed circuit board prototypes in a fraction of the time of an outside vendor and with absolute security of all data – perfect for today’s extreme time-to-market needs.

Small Footprint

The MultiPress S enjoys a remarkably small footprint. It measures only 600mm x 530mm (23.6” x 20.9”) making it ideal for small spaces in R&D and prototyping laboratories. LPKF also provides an optional table specially designed for the MultiPress S, or it can be placed on any surface certified to support at least 170 kg (375 lbs).

Programmable Profiles

Nine different heating/pressing/cooling profiles can be programmed into the MultiPress S’s microprocessor-controlled system, allowing for total customization of the process from start to finish.

Operation

The MultiPress S is delivered with an automatic hydraulic press mechanism, which provides constant and reliable pressure control. The LPKF MultiPress S can also be equipped with a hand pump instead of an automatic press to accommodate lower budgets.

Technical Specifications: MultiPress S

Max. Layout Size 200 mm x 275 mm (7.8" x 10.8")
Max. Laminating Area 229 mm x 305 mm (9" x 12")
Max. Laminating Pressure 286 N/cm² at 229 mm x 305 mm (9" x 12")
Max. Temperature 250 °C (480 °F)
Max. Number of Layers 8 (depending on material layout)
Pressing Time Approx. 90 mina
Dimensions (WxHxD) 600 mm x 620 mm x 530 mm (23.6" x 24.4" x 20.9")
Weight 170 kg (375 lbs)b
Power Supply 230 V, 50/60 Hz, 2.3 kW/2.8 kW1
Microprocessor controlled 9 Pressure-/temperature-/time profiles
Hydraulic unit dimensions 260 mm x 410 mm x 280 mm (10.4" x 16.2" x 11")
100 mm x 150 mm x 700 mm (3.9" x 5.9" x 27.6")1
Hydraulic unit weight 15 kg (33lbs), 5 kg (11lbs)1
1    With automatic hydraulics
a    Depending on material compound
b    Plus weight of hand pump or automatic hydraulics
Technical specifications subject to change.
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