ProtoPlace S4

The ProtoPlace S4 pick & place machines feature easy operation and high precision. In all the different models, use of standard and fine-pitch SMD components and placement of SOIC, PLCC, BGA, μBGA, CSP, QFN, and LEDs are possible. Intutive software interface allows for short setup times. The software guides the user through each step in the process. After each process step, the user confirms the function and is automatically guided to the next step. This is controlled via the integrated PC, which thus assumes the tasks of data preparation and machine control. The work area for the material and the positions of individual machine components such as the bottom camera, the nozzle changer, or the component holder are shown in the graphical display. Component holders for tapes, tubes, trays, and bulk parts can be placed on the work area which has maximum dimensions of (21.2” x 18.8”) 540 x 480 mm. Every pick & place system in the series has optical centering, a top camera for automatic fiducial correction, and a bottom camera for automatic component centering. The cameras can also be used for optical inspection of solder paste printing and component placement. To supplement the basic LPKF ProtoPlace S4.1 machine, LPKF offers three other versions with different additional functions: A contactless dispensing head is available for application of defined amounts of solder paste or adhesives (ProtoPlace S4.10). The “Smart Automatic Feeder” supports users with a higher throughput of PCBs, e. g., for processing low volumes (ProtoPlace S4.20). If both of these additional options are desired, then the ProtoPlace S4.30 is the system of choice.