Lead-Free Solder Paste

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This is a no-clean solder paste is a modified rosin based paste, which allows a previously unseen level of repeatability and consistency. The Patented Nihon Superior nickel stabilized tin/copper eutectic alloy has a melting point of 227°C.


  • Pin- Probable Residue
  • ROL0 to ANSI/J-STD-004
  • Enhanced activity for tough to solder boards and components
  • Excellent slump resistance
  • High speed stencil printing up to 100mm/sec
  • Excellent tack performance and printer open time
  • Extended “between-print” abandon time


The printing performance of solder paste depends in part on the metal content, solder alloy and the solder particle size range. Increasing metal content reduces the tendency to slump and reduces the tack life of the paste, while the solder balling performance improves.

Refrigeration and storage: It is recommended to store the paste at 5-10°C. The paste should be removed from cold storage a minimum of 8 hours in the unopened container prior to use. If the paste does not reach room temperature, it may stick to the stencil, not deposit onto the SMT pads, de-wet pads during reflow, outgas during reflow, or produce solder balls. Avoid direct sunlight.

Handling and shelf life: The optimum temperature is 75°F (24°C) and humidity is 60% or below respectively. Provided the paste is stored tightly sealed in the original container at 5-10°C, a minimum shelf life of 6 months can be expected. Air shipment is recommended to minimize the time that containers are exposed to higher temperatures.


The solder paste is currently available for stencil printing down to 16 mil (0.4mm) pitch devices with type 3 powder (-325 +500 mesh). Printing at up to 100 mm/sec. can be reliably achieved in production using a metal squeegee blade. This is due to a unique rheology, which ensures that the higher shear rate viscosity is relatively low and the thixotropic index is high enough to ensure excellent definition and slump resistance, while maintaining good roll and drop off behavior. High squeegee pressures are not required, making the paste particularly useful for second side printing processes.


Reflow should be performed at 59 - 86°F (15 - 30°C) above the liquid temperature of the alloy (depending on the type of board). This temperature should be maintained for 30 - 45 seconds. Profiles should have less than a 3-minute preheat time above 260°F (130°C) to insure proper wetting of fine pitch leads.


  1. strongRamp to 120 - 140°C at 2 degrees Celsius per second
  2. Hold at 130 - 160°C for 60 – 120 seconds
  3. Ramp to peak reflow at 2 degrees Celsius per second
  4. Recommended peak reflow temperature is 240 - 255°C

Dwell above liquids for 30 – 60 seconds


If cleaning is required, use a semi-aqueous solvent or DI water with a saponifier such as Florida Cirtech RA2000 (saponifier concentration 4-6% @ 120-150°F).

Health & Safety

This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product.


The SN100C NL900 solder paste is available in: 30 gram syringes and 250 gram jars.

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