MicroLine 2000 P

The LPKF MicroLine 2000 systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.

LPKF MicroLine 2000 process advantages Compared to conventional tools, laser processing offers a compelling series of advantages.

• The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
• In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
• The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
• The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
• The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

MicroLine 2000 P - Processing Flat Substrates

UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required. In that case, the UV laser reduces the lead time and total costs with every new product layout. The LPKF MicroLine 2000 P is optimized for these work steps.

• Complex contours
• No substrate brackets or cutting tools
• More panels on the base material
• Perforations and decaps

The MicroLine 2000 P can be customized to fit your applications. Its inline chassis and can be equipped with either a 10, 15 or 27 watt nanosecond UV or 36 Watt nanosecond green laser source. An exhaust unit removes all material evaporated by the laser energy, ensuring board surfaces are residue-free.