3D Circuitry on Thermoplastics

3D molded interconnect devices (MIDs) utilize the best of both mechanical and electrical design - saving space, reducing cost, and increasing reliability. With the ever-present trend towards miniaturization and the need for versatile production options, laser direct structuring (LDS) has been at the forefront of the MID resurgence.

Laser direct structuring is a 3-step process for creating MIDs that makes entering their world a viable option for companies in all industries - from automotive to medical to telecommunications. Register for this original webinar to learn why creating 3D circuitry on thermoplastics may be right for you.

In The Webinar:

• Why designers should consider 3D circuitry on thermoplastics
• Benefits and history of the molded interconnect device
• What laser direct structuring is and how it works
• MID applications created with LDS

Who This Will Benefit:

• Electrical designers and engineers
• Mechanical designers and engineers
• Antenna designers
• Wiring harness designers
• Chief technology officers
• Manufacturing and production engineers
• Designers in any of the following industries: automotive, medical, telecommunications, security, RFID, micropackaging