LDS MID Design Guide

Developing molded interconnect device components is a challenging procedure no matter which process or technology is used. This LDS MID Design Guide helps interdisciplinary developers produce MIDs based on the LPKF laser direct structuring process. 
Topics include:

• Injection molding design rules
• Tool design
• Data prep for laser processing
• Metallization process rules
• Thermal conditioning

Complete the form to receive instant access to this powerful tool.