3D LDS Components: New Opportunities in PCB Layout and Production
By Malte Borges
September 2014

Space Saver
February 2014

What are molded interconnect devices?
January 2014

LPKF Researchers Develop Powder Coating for Molded Interconnect Devices
May 2013

Using Laser Direct Structuring (LDS) to Create Robust Hardware Security Devices
By Jim Liddle
October 2012

3D LDS Components for New Production Opportunities
February 14, 2012

3D MID Sensor Fabricated with Ticona Laser-activated LCP Circuits
January 25, 2012

Molex transfers 3D electronics to medical devices
November 7th, 2011

Reliability Study of Stud Bump Bonding Flip Chip Assemblies on Molded Interconnect Devices
By Marc Dressler
March 29, 2010

Molex Ships 100 Millionth Antenna with Laser Direct Structuring (LDS) Technology
October 26th, 2010

3D LDS Components for New Production Opportunities
By Wolfgang John
October 2010

CONNECTORS & CORDS: Laser Lays it On
By Mary Lowe
Appliance Design Magazine, February 1, 2006

Manufacturing of Molded Interconnect Devices from Prototyping to Mass Production with Laser Direct Structuring
by Nils Heininger, Dr. Wolfgang John I & T and Hans-Jürgen Boßler
Presented at the MID Congress 2004, Erlangen, Germany

Laser-based production of multifunction packages taking innovative rotary encoders for automation and vehicle technology as examples
by Nils Heininger, Dirk Ahrendt, Wolfgang Eberhardt, Heinz Kück, Lars Blassmann, Christoph Hanisch and Stephan Schauz
Presented at MID Meeting 2004 Japan