MicroLine 2000 Ci
Versatile, affordable, inline laser depaneling
The LPKF MicroLine 2000 Ci is ideal for anyone who needs a versatile, efficient depaneling method. Powered by UV lasers that make clean, burr-free cuts, MicroLine 2000 Ci systems eliminate mechanical stress and greatly limit thermal stress. This makes the MicroLine 2000 Ci perfect for depaneling any substrate - from FR4 to ceramics, polyesters, and more.
The MicroLine 2000 Ci can be customized to fit your applications. Its inline chassis and can be equipped with either a 10, 15 or 27 watt nanosecond UV or 36 Watt nanosecond green laser source. An exhaust unit removes all material evaporated by the laser energy, ensuring board surfaces are residue-free. The built-in SMEMA interface allows users to add external loaders and/or conveyors of their choice (handling equipment as shown above is not included).
Technical Specifications: MicroLine 2000 Ci |
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| Laser Class | 1 |
| Max. Working Area (X.Y.Z) | 300 mm x 250 mm x 11 mm (11.8" x 9.8" x 0.4") |
| Max. Recognition area (X.Y) | 300 mm x 250 mm (11.8" x 9.8") |
| Max. Material Size | 300 mm x 250 mm (11.8" x 9.8") |
| Data Input Formats | Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB++ |
| Max. Structuring Speed | Dependant on application |
| Positioning Accuracy | +/- 25 µm (1 mil) |
| Diameter of Focused Beam | 20 µm (0.8 mil) |
| Laser Wavelength | 355 nm or 532 nm |
| System Dimensions (WxHxD) | 875 mm x 1530 mm x 1300 mm (34.5" x 60.2" x 51.2")* |
| Weight | 450 kg (990 lbs) |
| Operating Conditions | |
| Power Supply | 85 V- 260 V AC, 50-60 Hz, 440 W |
| Cooling | Air-cooled (internal water-air cooling) |
| Compressed Air | 0.6 Mpa (87 psi) |
| Ambient Temperature | 22 °C +/- 2 °C (72 °F +/- 4 °F) |
| Humidity | <60% (non-condensing) |
| Required Accessories | Exhaust unit, external conveyor, production fixture |
Technical specifications subject to change.
MicroLine 2000 systems are available in multiple variations: 10 W, 15 W, 27 W UV lasers, or a 36W green laser.
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