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Copper Board Material

Copper cladded FR4 board material. Epoxy substrate with glass fiber enforcment. Compliant with electroplating.

Multi Layer Material

Multi-Layer material and accessories.

Prototype SMT Stencils

Polymide foil to be cut with ProtoMat plotter to create prototype SMT stencils. Compatible with ZelFlex stencil frame.

Solder Mask and Silk Screen

Solder Paste

Lead-Free Solder Paste

Underlay Material

Underlay material is used to protect the LPKF machine’s table top or vacuum table during the drilling and routing phases. The LPKF underlay material is very flat & has a smooth surface with a white, very thin, hard coating on both sides to meet the highest demands for drilling quality.