The LPKF Laser-based PCB development systems allow for rapid metal removal on a wide range of laminated PCB substrates and enable traces at and even below 1 mil (25µm) on fired ceramics. Pristine edge quality allows the laser etched designs to match simulation software nearly perfectly and the fine pitch traces and spacing are ideal for HDI (High Density Interconnect) PCB design requirements. This technology provides advanced prototyping and true production on-demand solutions.
With its compact tabletop format, the LPKF ProtoLaser H4 can be used in any laboratory for processing materials from FR4 to sensitive RF substrates. The laser system achieves exact geometries on almost any material and is ideal for creating single or double-sided circuit boards, antennas, filters and many applications where precise, steep sidewalls are required and includes mechanical drilling and cutting with a 6 position automated tool change for thicker PCB materials.
Ultra-fast PCB Laser Etching, cutting and drilling with the LPKF 532nm laser source and a 23µm focused beam diameter. Ideal for laminated substrates and alumina based ceramics allowing fine pitch PCB development.
Pristine PCB Laser Etching quality with the LPKF 355nm laser source and 20µm focused beam diameter enables the smallest traces and spacing laminated substrates and alumina based ceramics in addition to controlled laser drilling, cutting, skiving and depth engraving.
High precision Direct Laser Etching for micro PCB development and research applications with 1.5 picosecond pulse duration at 515nm using the LPKF patented hatch & delamination removal process and direct laser ablation processing. Ideal for sensitive substrates, creating traces below 1 mil (25µm), pocket engraving and for cutting or drilling of materials transparent to nanosecond pulse such as glass and Teflon materials or thin flex substrates.