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The LPKF Laser-based PCB development systems allow for rapid metal removal on a wide range of laminated PCB substrates and enable traces at and even below 1 mil (25µm) on fired ceramics. Pristine edge quality allows the laser etched designs to match simulation software nearly perfectly and the fine pitch traces and spacing are ideal for HDI (High Density Interconnect) PCB design requirements. This technology provides advanced prototyping and true production on-demand solutions.